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  • China Industrial Resin Bond Wafer Saw Blade , Thickness 0.25MM Dicing Saw Blade for sale
  • China Industrial Resin Bond Wafer Saw Blade , Thickness 0.25MM Dicing Saw Blade for sale
  • China Industrial Resin Bond Wafer Saw Blade , Thickness 0.25MM Dicing Saw Blade for sale
  • China Industrial Resin Bond Wafer Saw Blade , Thickness 0.25MM Dicing Saw Blade for sale

Industrial Resin Bond Wafer Saw Blade , Thickness 0.25MM Dicing Saw Blade

Product Details

Hongtuo
HT-RB
ISO9001:2015&ISO16949
China
2
Price can be negotiated
T/C,T/T
300/pcs per month
2-3weeks
Carton Box
Machine Blade
Diamond
58
Semicoductor,Ceramic chips
0.25MM
Resin
Product Description >

Company Profile

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Active Member
zhengzhou,China
Manufacturer
Importer
Exporter
Seller

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