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  • China Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz for sale
  • China Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz for sale
  • China Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz for sale
  • China Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz for sale

Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz

Product Details

Hongtuo
HT-RB
ISO9001:2015&ISO16949
China
2
Price can be negotiated
T/C,T/T
300/pcs per month
2-3weeks
Carton Box
Machine Blade
Diamond
Other
58
Semicoductor,Ceramic chips
0.25MM
Resin
Product Description >

Company Profile

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
Active Member
zhengzhou,China
Manufacturer
Importer
Exporter
Seller

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